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David Block stein, a senior scientist with the National Council for Science as well as the Environment, an environmental science advocacy group in Washington. Under President Bush's 2003 budget proposal, most of the program's $ 100 million budget remains intact, though the fellowships would end, apparently falling victim with an effort by the administration to consolidate financing for environmental education beneath the National Science Foundation. A staff member for that House Committee on Science, which inspects aspects of each agency, said the fellowship ended up lost inside the shuffle. "It is unseen up within their budget, with out one knows anything about it," the employees member said, "It's not necessarily explicit why this method will be cut. "




Foreign-owned auto sunroof goods are prohibitively expensive for many domestic complete vehicle manufacturers in China. Currently, an increasing number of domestic enterprises in China set out to enter the auto sunroof industry, for example Taizhou Yifa, Zhejiang Shenghuabo, Taizhou Yuejin, etc. However, because of the difficulties of technology, capital, etc., these enterprises have neither formed certain scale nor provided supporting experience for well-known complete vehicle manufacturers. The auto sunroofs created by China's domestic enterprises have single varieties, weak compatibility and quality and unguaranteed after-sales services, that's an important reason for their difficulty to formulate rapidly. The prices of auto sunroofs produced by foreign-owned enterprises are generally above CNY 5,000, while those manufactured by China's domestic enterprises will like over CNY 1,000 of gross profits even if they're coming in at CNY 2,000. It is predictable that increasingly more enterprises will launch into R&D and creation of auto sunroofs. Without doubt, they should type in the OEM market rich in gross profits and free themselves from the mistakes of only supporting the remodeling market and also the aftermarket; otherwise are going to eliminated gradually.




* Which existing connector types are poised for exceptional sales growth? * What new electronic products and technologies are driving this connector growth? * How will the current global economic decline and recovery impact the adoption rate of recent interfaces? * Which industry segments will utilize these connectors? Which segments will require the development of entirely new interfaces to address specific applications? * Who are the leading manufacturers of such connectors? * How are power connectors being adapted to provide greater power and signal density while supporting system thermal management strategies? * How do connector manufacturers differentiate a few defined by a market specification? * What specific applications will drive the growth of those connectors? * What is the forecasted global market value of those growth connectors on the 2009 through 2013 period? * How much of the growth will likely be affected by formal, defacto or special-interest-group-generated standards? * What is driving increasing interest in electronic system design that conforms to standardized hardware platforms? * Which exiting connectors, defined by a niche standard, continues to evolve regarding bandwidth and signal density? * Will new system packaging techniques including orthogonal midplane designs become widely adopted over the next 3-5 years? * Will new material technology alter the way connectors are created, fabricated and utilized? * Will systems depending on 85-ohm impedance dominate a or co-exist with 100-ohm systems? * How will system designer interest in quicker and density interfaces influence the creation of next-generation connector technology? * Are one-piece, high-performance edge connectors experiencing upset? Why? * Has the performance/cost curve of fiber-optic connectors finally tipped the advantage to fiber over copper in I/O applications? * How will global environmental mandates influence the design of future interconnects? * How is the convergence of computing, communications and consumer entertainment influencing the design of interconnects? * What new classes of merchandise, for example wireless video, light-emitting diode illumination and sustainable energy generation, will demand the development of latest interconnect systems? * What technology gaps exist that needs to be addressed to be able to satisfy next-generation equipment interconnect requirements? * What effect will the adoption of wireless devices placed on copper cabling and connectors? * How are design engineers addressing potentially conflicting objectives of signal density, power density and thermal density? * How is the trend toward mobile computing, communication and entertainment influencing the ability to deliver power? * Will smaller semiconductor geometries suffer from reduced potential to deal with ESD damage? * In what applications are high-speed Ethernet and Infiniband protocols most effectively applied? * How are global demographics influencing the development of new electronic products as well as overall market size? * How are high-speed backplane and I/O connectors evolving to handle the difficulties of 40 to 100 Gb/s bandwidth? Are copper 40+ Gb/s interfaces a viable solution, or has copper finally reached its practical bandwidth limit? * How will connector manufacturers address potentially conflicting requirements for identical second sources and protection of intellectual property? * Will Serial ATA and SAS still dominate the storage interconnect landscape? * What new interfaces will dominate emerging automotive applications including infotainment, networking, power management and battery charging? * How will cloud computing and hardware virtualization influence the markets for computing equipment later on? * All of these topics yet others are discussed in this new report on Connector Types and Technologies Poised for Growth.